wafering

切片
常用释义
n. 切片;[力]压扁
v. 把……制成饼干状饲料;把……切成薄片(wafer 的 ing 形式)

例句

1·The parameters deciding the quality in polishing process are as follows: slurry, temperature, wafering time, and so on.

抛光过程中决定抛光质量的参数有:抛光浆体、抛光温度、抛光时间等。

2·Thirdly, the parameters deciding the quality in polishing process are as follows: slurry, polish pad, pressure, temperature, rotation speed, wafering time, and so on.

在抛光工艺中,抛光液的种类、抛光垫的选择、抛光压力、温度、抛光盘转速、加工时间等诸多条件都是决定抛光质量的重要因素。

常用短语

silicon wafer
silicon wafer - 硅片
semiconductor wafer
semiconductor wafer - 半导体薄片
circuit wafer
circuit wafer - 电路板

同义词

n.
切片;[力]压扁