1·For example of solder ball, flux residues, clamping marks.
如锡珠，助焊剂痕迹，夹抓纹之清理。
2·At the same time, experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
3·In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...
文中主要探讨了覆晶封装底胶充填时，锡球、芯片及基板间的流动状况。
4·Welding can be easily shattered the tin-oxide layer, contact stability, which does not damage solder ball;
能轻松刺破焊接锡球的氧化，接触稳定，而又不会损坏锡球。
5·The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.
最大累积等效蠕变应变位于内层焊点，且在芯片边缘。
6·Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.
最后探测锡球配置方式和缓冲层材料性质对于锡球疲劳寿命的影响，以获得高可靠度的封装结构。
7·It can solve the problems such as inhomogeneous heating of different solder bumps in ball grid array, simultaneous heating of chip and carrier with solder ball, etc.
该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题，如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等。
8·Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
9·Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
10·The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。