1·Cu and Pb ions in the alloy plating bath and composition of its deposits.
此法已被成功应用于测定锡-铜-铅合金电镀液及其镀层中的锡、铜和铅。
2·The maintenance of the plating bath and precautions of the operation were introduced.
讨论了镀液组分及操作条件的影响，并介绍了镀液的维护方法。
3·An autocatalytic electroless plating bath for coating silver metal is also described.
还公开了涂布银金属用的自催化的无电镀覆浴。
4·The plating bath is stable and easy to control, it can substitute all rack plating chromium.
镀液稳定容易控制，可以代替部分挂镀铬和全部滚镀铬。
5·So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
6·Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating.
采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
7·Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
8·The key for research and development of stabilizers is to improve the stability of electroless plating bath.
同时介绍了描述稳定剂吸附的几个模型，并指出稳定剂的研发是今后镀液稳定性得以提高的关键。
9·Analysis methods of nickel, zinc and boric acid in an acidic zinc-nickel alloy plating bath were established.
制定了酸性锌镍合金镀液中镍、锌和硼酸的分析方法。
10·Copper sulfate in acid copper plating bath was determined by spectrophotometry with EDTA as chromogenic agent.
用EDTA作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。