1·Today, all developments regarding rigid-multilayer board have been implemented to rigid-flex printed circuit boards.
今天，凡是在刚性多层板的技术进步，同样，在刚-挠性印制板也是能够实现的。
2·Best layout and performance are achieved with at least a 4-layer multilayer board, where there is a ground plane layer, a power supply layer, and two signal layers.
电路板至少需要4层才能实现最佳布局和性能：一个接地层、一个电源层和两个信号层。
3·The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
4·Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex.
多层印制板的制作是一个生产工序复杂且周期很长的过程，那么造成金属化孔镀层空洞的原因也就很复杂。
5·Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board.
用于挠性印刷线路板的具有基材的粘合片，其制造方法，多层挠性印刷线路板和挠性-刚性印刷线路板。
6·The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
7·Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。
8·Therefore, the interlayer connecting section is compressed, and the multilayer printed wiring board having high connection reliability is obtained.
由此，得到一种层间连接部被压缩且具有高连接可靠性的多层印刷线路基板。
9·Said invention utilizes plastic film or plastic board as the water-proof layer of root, while the plastic layer is mounted on the surface of root or in the one layer of multilayer structure of root.
本发明用塑料薄膜或塑料板作为房顶的防水层，塑料层位于房顶表层，或位于房顶多层结构中的其中一层。