1·The morphology of formed intermetallic compound in ZA50 alloy was analyzed also.
分析了合金元素形成的化合物在ZA50合金中的形貌特征。
2·The intermetallic compound is a kind of potential functional material with high strength, low weight and large electrical resistivity.
金属间化合物具有高强轻质及电阻率较高的特点，是一种极具发展前途的功能材料。
3·Intermetallic compound foam reinforced aluminium alloy surface composite layer are obtained by solution treatment after low pressure Casting.
通过低压铸造后固溶处理的方法，获得了网状金属间化合物增强铝合金表面复合层。
4·Composite alloy coatings of intermetallic compound dispersed and distributed in amorphous alloypossess excellent corrosion resistance and abrasion performance.
非晶基上弥散分布着金属间化合物的复相合金镀层，具有优异的耐蚀性及良好的耐磨性。
5·The results showed that the hot-dip aluminizing coatings on both the J55 and N80 steels were composed of aluminum layer and Fe-Al intermetallic compound layer.
结果表明：J55和N80钢热浸镀铝后的镀层组织均可分为纯铝层和铁铝金属间化合物层两层；
6·In fact, the thickness of the intermetallic layer is determined by a combined process including simultaneous dissolution and growth of the intermetallic compound.
实际上，在化合物层的生长过程中同时也伴随着溶解过程，由于其生长速度大于溶解速度，化合物层厚度随钎焊时间的增加而增加。
7·Diffusion bonding under pulsatile pressure is an ideal bonding method, which can accelerate diffusion, reduce the amount of intermetallic compound and improve its distribution.
脉冲加压扩散焊能促进扩散过程，减少金属间化合物的形成，改善其分布，是一种较有前景的扩散焊方法。
8·The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
9·The results indicate that the brittle intermetallic compound in weld is the main reason why the weldability of the plate is bad, which leads to cracks under the effect of welding stress.
通过分析TA2和Q 235b的焊接性，论述了钛与钢熔焊焊缝脆裂的机理，指出钛钢复合板焊接性能差的主要原因在于焊缝中产生了脆性的金属间化合物，从而导致焊缝在焊接应力的作用下发生开裂。
10·Up to now, the technology has been used to prepare supersaturated solid solution, amorphous alloys, intermetallic compound, nanocrystalline, magnetism materials, superconductor materials, and etc.
现在，运用这一技术已成功制备出过饱和固溶体、非晶、金属间化合物、纳米晶材料和超导材料、磁性材料等。