1·In the forming process of the solder embossment, a top (27) of a plurality of solder embossments (22) is flatted and roughened.
在焊料突起成形工序中，对多个焊料突起(22)的顶部(27)进行平坦化及粗糙化。
2·In the supply process of solder, a welding fluid (28) is supplied to the top (27) of a plurality of solder embossments (22) which is flatted and roughened.
在焊剂供给工序中， 向已被平坦化及粗糙化的多个焊料突起（22）的顶部（27）供给焊剂 （28）。