copper clad laminate

铜包覆层压板:一种用于电子电路板制造的材料
常用释义
铜包覆层压板:一种用于电子电路板制造的材料,由铜箔和绝缘材料层交替堆叠而成。铜箔提供电导性,而绝缘材料层用于隔离电路。

例句

1·Various polyimide was synthesized from 3-BAPP with various dianhydrides. The application of the polyimiders to two-layer flexible copper clad laminate(2L-FCCL)was researched.

用3-BAPP与多种二酐合成出多种聚酰亚胺,并在二层法挠性覆铜板(2L-FCCL)的应用方面做了一些研究。

2·The invention relates to a halogen-free flame-retardant epoxy resin composite, the flexible copper clad laminate made from the epoxy resin composite and the production method.

本发明涉及一种无卤阻燃环氧树脂组合物、使用其制作的挠性覆铜板及其 制作方法。

3·In recent years, flexible printed circuit boards based on two layer flexible copper clad laminate has been widely applied in folding mobile phone, digital camera and notebook computer etc.

近年来,以二层覆铜板为基材的挠性印制电路板,具有薄、轻、结构灵活的鲜明特点,被广泛应用于折叠手机、数码相机、笔记本电脑等。

4·It could accord with the requirement of environment protection completely. And because of the addition of aluminum hydroxide, the production cost of copper clad laminate was reduced greatly.

该无卤化覆铜板完全符合环保要求,而且由于添加了氢氧化铝,大大降低了生产成本。